Low K Dielectrics

50 %
50 %
Information about Low K Dielectrics

Published on July 22, 2008

Author: gueste06e72

Source: slideshare.net

Description

Low k dielectrics

Low- k Dielectrics: Materials and Process Technology Pawan Mishra Roll No: 07PH6207 Dept: Physics & Meteorology IIT Kharagpur

Outline Motivation for low- k dielectrics Required properties of low- k dielectrics Proposed materials Most promising materials CVD vs. Spin-on techniques Conclusion

Motivation for low- k dielectrics

Required properties of low- k dielectrics

Proposed materials

Most promising materials

CVD vs. Spin-on techniques

Conclusion

Why Low- k Dielectrics? Reduce RC constant without reducing size R metal interconnect minimized with Cu C dielectric need low- k

Reduce RC constant without reducing size

R metal interconnect

minimized with Cu

C dielectric

need low- k

Required Properties of Low- k Dielectrics

Proposed Materials

Silica Based (SiOF):k~3.5 Silica –Tetrahedral basic structure of SiO2 F substitution F more then 4% not stable .

Silica –Tetrahedral basic structure of SiO2

F substitution

F more then 4% not stable .

SSQ ( Silsesquioxane ) Based: HSQ&MSQ ( k = 2.8) “ Carbon-doped oxide” High thermal stability Resistance to cracks

“ Carbon-doped oxide”

High thermal stability

Resistance to cracks

Organic: Parylene-F Parylene-F ( k = 2.4) Better thermal and mechanical stability Poor adhesion can lead to corrosion http://www.paryleneinc.com

Parylene-F ( k = 2.4)

Better thermal and mechanical stability

Poor adhesion can lead to corrosion

Organic: PTFE ( k = 1.9) Oxidation resistant Non porous Thermal stability Good adhesion with stability

Oxidation resistant

Non porous

Thermal stability

Good adhesion with stability

Porous Organics and Inorganics Add closed cells of air to materials that show promising characteristics Dielectric constants below 2.0 (1) “Low- k Dielectrics.” http://fcs.itc.it/

Add closed cells of air to materials that show promising characteristics

Dielectric constants below 2.0

Disadvantages of Porous Materials Weakens mechanical properties Lower thermal conductivity pore distribution Unclosed pores

Weakens mechanical properties

Lower thermal conductivity

pore distribution

Unclosed pores

Air Gaps ( k = 1.0) Low breakdown voltage Low thermal stability Low strength Deposition method unknown

Low breakdown voltage

Low thermal stability

Low strength

Deposition method unknown

CVD vs. Spin-on Deposition Industries split between CVD and spin on. Currently CVD dominates for k 2.5 and spin on dominates for k 2.5 porous films

Industries split between CVD and spin on. Currently CVD dominates for k 2.5 and spin on dominates for k 2.5 porous films

CVD vs. Spin-on Deposition CVD k as low as 2.0 Porosity cannot be added Better mechanical stability Better thermal stability Technology in place Less expensive Batch process SOD k as low as 1.9 k below 1.9 by adding porosity More promising low-k materials More uniform deposition Extendable to future technologies Single-wafer process

CVD

k as low as 2.0

Porosity cannot be added

Better mechanical stability

Better thermal stability

Technology in place

Less expensive

Batch process

SOD

k as low as 1.9

k below 1.9 by adding porosity

More promising low-k materials

More uniform deposition

Extendable to future technologies

Single-wafer process

Conclusions Introduction of low- k dielectric is needed in order to continue to downscale technology Several CVD or Spin-on deposited materials look promising for the near-future generations Spin-on porous materials appear to be the only option for future generations Air gaps need more research in order to be considered for future low- k dielectrics

Introduction of low- k dielectric is needed in order to continue to downscale technology

Several CVD or Spin-on deposited materials look promising for the near-future generations

Spin-on porous materials appear to be the only option for future generations

Air gaps need more research in order to be considered for future low- k dielectrics

References ( 1) Fisica Chimica delle Superfici e Interfacce. “Low- k Dielectrics.” < http://fcs.itc.it/MAMeBROCHURE/low-k%20dielectrics.pdf > .   (2) Clarke, Michael E. Application Note MAL123: “Introducing Low- k Dielectrics into Semiconductor Processing.” Mykrolis. . < http://www.mykrolis.com/publications.nsf/ docs/MAL123 >   (3) Plumber et al. “Back-end Technology.” Silicon VLSI Technology: Fundamentals, Practice and Modeling . Chap. 11. Prentice Hall, NJ, USA. .   (4) Nishi, Yoshio and Doering, Robert. “Alternate Interlevel Dielectrics.” Handbook of Semiconductor Manufacturing Technology . Chap. 12. Marcel Dekker, Inc.

( 1) Fisica Chimica delle Superfici e Interfacce. “Low- k Dielectrics.” < http://fcs.itc.it/MAMeBROCHURE/low-k%20dielectrics.pdf > .

 

(2) Clarke, Michael E. Application Note MAL123: “Introducing Low- k Dielectrics into Semiconductor Processing.” Mykrolis. . < http://www.mykrolis.com/publications.nsf/ docs/MAL123 >

 

(3) Plumber et al. “Back-end Technology.” Silicon VLSI Technology: Fundamentals, Practice and Modeling . Chap. 11. Prentice Hall, NJ, USA. .

 

(4) Nishi, Yoshio and Doering, Robert. “Alternate Interlevel Dielectrics.” Handbook of Semiconductor Manufacturing Technology . Chap. 12. Marcel Dekker, Inc.

THANKS

Add a comment

Related pages

Low-k dielectric - Wikipedia, the free encyclopedia

Low-k dielectric In semiconductor ... in conversation such materials are referred to as being "low-k" (low-kay) ... insulating dielectrics separate the ...
Read more

Low-K Dielectrics - Stanford University

1 ta nfo rdU ivesy 1 EE311/ Low-k Dielectrics araswat Prof. Krishna Saraswat Department of Electrical Engineering Stanford University Stanford, CA 94305
Read more

Next Generation of Low-k D Dielectrics

Title: Next Generation of Low-k D Dielectrics Author: Rebeca C. Diaz Last modified by: Jerzy Ruzyllo Created Date: 4/5/2006 3:16:44 AM Document ...
Read more

How are dielectrics classified as high-K and low-K ...

– High-k dielectrics are dielectrics having a dielectric constant, or k-value, higher than that of silicon nitride (k > 7). – Low-k dielectrics are ...
Read more

Low- k dielectric materials - ScienceDirect

A simplified classification scheme of low-k dielectrics. Figure options. ... the porosity of a low-k film should be as low as possible to provide ...
Read more

Low- k Dielectrics - Springer

Fig. 22.2. Technology trends of low-k dielectric film: (a) the k-value as a function of LSI technology node and the low-k deposition processes of (b) spin ...
Read more

AGC - Low-k dielectrics - agcem.com

AGC's leading edge AL-X Series, photo curable Low-K dielectric polymer for electronic and wafer level packaging (WLP) meets the most demanding industry ...
Read more

Interconnections: Copper & Low K Dielectrics

EE311 Notes/Stanford Univ. Prof. Saraswat Interconnections: Copper & Low K Dielectrics ITRS 2002 Interconnect Scaling Recommendations Narrow line effects
Read more

Low-k dielectrics | Microelectronics | Research topics ...

Low-k dielectrics. Aluminum as an interconnect material in combination with silicate glasses as insulators have been exclusively used for IC metallization ...
Read more

Low-k-Dielektrikum – Wikipedia

Als Low-k-Dielektrikum wird in der Halbleitertechnologie ein Material bezeichnet, das eine niedrigere Dielektrizitätszahl als SiO 2 aufweist, d. h. ε r ...
Read more