d01 005i

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Published on December 1, 2007

Author: Elodie

Source: authorstream.com

Slide1:  Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Polymers for Lightweight/Affordable Radar Workshop December 7-8, 2000 Len Chorosinski Northrop Grumman Corporation Electronic Sensors & Systems Sector 1745A West Nursery Road - MS 368 Linthicum, MD 21090 410-993-1380 Fax: 410-981-5226 leonard_g_chorosinski@mail.northgrum.com Slide2:  Overview Need Proposed Solution Project Objectives Technical Approach Antenna/Substrate/Membrane Design Large Scale Manufacturing Other Enabling Technology Needs Summary Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide3:  Need LEO satellite constellation for space-based radar Current antenna packaging is expensive and heavy rigid panels and hybridized T/R modules in hermetic enclosures current costs over $1M/m2 and weights over 22 Kg/m2 Future antennae are projected to be much larger from 40 m2 to 130 m2 to 200 m2 Cost of launch vehicles alone may preclude deployment feasibility Need low cost, lightweight, stowable, large antennae Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide4:  Proposed Solution Fabricate the antenna on a flexible membrane that could be folded or rolled-up printed flex circuit technology Use inflatable structures to deploy the membrane already proven Use chip-on-board to eliminate heavy T/R modules hermeticity not needed for reliability integrate electronics into the antenna substrate multi-layer flex with buried passives Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide5:  Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Inflatable JPL/ILC Dover SAR Antenna :  Inflatable JPL/ILC Dover SAR Antenna Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide7:  Project Objective Develop a low cost base-line process on lightweight flex substrate extendable to large scale manufacturing for mechanically conformal antenna array small scale 2 x 2 antenna array to demonstrate approach chip-on-board T/R chip set on backside of antenna Low cost goal: less than $250K/m2 Lightweight goal: less than 6 Kg/m2 Scalable to large size deployed size of 132 m2 (6 m x 22 m) Stowed size TBD Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide8:  Technical Approach Use liquid crystal polymer (LCP) for flex circuit substrate instead of Kapton (unsupported polyimide) 20% to 50% the cost of Kapton self-reinforcing uniform dielectric low dielectric constant of 2.9 low loss suitable for high speed/high frequency applications, tan d ~ 0.002 low coefficient of thermal expansion substrate target is 5 to 8 ppm/C Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide9:  Technical Approach (continued) high strength tensile strength of 30 Kpsi tensile modulus of 1.3 Mpsi good adhesion to metals copper peel strength = 6 pli very low moisture absorption (<0.02 percent) specific gravity = 1.4 projected weight estimate for the proposed flexible antenna substrate is about 2 Kg/m2 Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications What is Liquid Crystal Polymer (LCP)?:  What is Liquid Crystal Polymer (LCP)? Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Liquid Crystal Polymers Have Rigid Segments Which Tend to Align in Shear Flow:  Liquid Crystal Polymers Have Rigid Segments Which Tend to Align in Shear Flow Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Biaxial Orientation is Achieved Using the Counter-Rotating Die:  Biaxial Orientation is Achieved Using the Counter-Rotating Die Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Uniaxial and Biaxial Orientation of LCPs:  Uniaxial and Biaxial Orientation of LCPs Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Producing LCP Films with In-Plane Isotrophy (CTE):  Producing LCP Films with In-Plane Isotrophy (CTE) Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications CTE of a 4 mil LCP Laminate as a Function of Copper (1/4 Ounce):  CTE of a 4 mil LCP Laminate as a Function of Copper (1/4 Ounce) Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Available LCP Films Already Tested:  Available LCP Films Already Tested Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Laminate Material Cost Guide:  Laminate Material Cost Guide Cost Estimate Assumptions: a) 18 in. x 24 in. laminate with 1 oz copper on both sides. b) Quoted quantities of 10-29 panels Note: This guide’s intent is to summarize information related to widely used microwave material. However, users are encouraged to obtain data sheets and cost estimates, since both can change periodically. Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide18:  Technical Approach (continued) Antenna Design simple 2 x 2 array 10 GHz demonstration printed slot-coupled patch radiators on front side integrated chip-on-board GaAs MMIC T/R chipset on backside Flip chip attach un-thinned coplanar GaAs MMICs lower cost than wire bond die cost is 50% to 70% of thinned GaAs MMIC assembly cost is 60% to 70% of wire bond twice the reliability of wire bonded assemblies superior performance lower parasitics than wire bond (6X improvement) Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide19:  Initial Flex Antenna and T/R Function Approach Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide20:  Use coplanar flip chip approach for basic T/R functions Switch, LNA, and PA at X-band Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide21:  Technical Approach (continued) Substrate Design work with Foster-Miller and HiDEC investigate candidate LCP materials for substrate(s) evaluate various lamination/assembly approaches ALIVH (Any Layer Inner Via Hole) “conventional” drilling and plating lay-up schemes for flexibility devise large scale manufacturing schemes interface with ILC Dover and/or L’Garde inflatable space frame requirements Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide22:  Multi Layer Flex Stack-up Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide23:  Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide24:  Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide25:  Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membrane for Space-based Radar Applications Slide26:  Technical Approach (continued) Large scale manufacturing in-line reel-to-reel processing currently marketed by Phillips Sheldahl already using in-line technology currently with polyimide films but interested in LCP other manufacturers are also investing can be done in continuous or indexed fashion indexed can use existing equipment LCP film already produced in a continuous process Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide27:  1. Pattern All Layers Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications 3. Print Solder Paste and Optical Waveguide and Populate 2. Laminate Layers Together Test Slide28:  Devices Radiating Elements Long Flex Representative View of Flex Assembly Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide29:  Align and Attach Antenna Strips Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide30:  XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Attach to Inflatable Structure and Make Base Connections Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide31:  Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide32:  Technical Approach (continued) Other enabling technology needs R-FLICS (Radio Frequency Lightwave Integrated Circuits) need small, flip chip modulators and detectors printed optical waveguides off-shoot of ink jet/solder jet technology Microjet printing by MicroFab Technologies initial tests successfully performed (with lossy material) power distribution chip low profile, high efficiency (>90%) DC-DC converter under development at Lucent/Bell Labs and others Fluidic Self-assembly (FSA) Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications Slide33:  Summary Develop the basic process parameters for LCP multilayer flex Address fundamental packaging issues radius of curvature, CTE, strength, etc. current handling, RF and DC losses, interconnection, etc. Fabricate simple demonstration vehicle 2x2 subarray at 10 GHz Show scalablity to large area antenna manufacturing Basic technology is applicable to many military and commercial applications Low Cost, Lightweight, Inflatable Antenna Array Development Using Flip Chip on Flexible Membranes for Space-based Radar Applications

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