Battery powered Applications: Selection Guide | Infineon Technologies

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Information about Battery powered Applications: Selection Guide | Infineon Technologies

Published on March 12, 2014

Author: infineon



Find here all Information about Battery powered Applications, Package Information and Motor Control Secection Matrix for OptiMOS™ and Small Signal. Find out more about Infineon on our Homepage:

Selection Guide for Battery Powered Motor Drives Designed to Drive Your Innovation

2 Ictam quodita dolorep 300W Motor Control Application Kit A High Efficiency Demonstrator Driving Your Innovation The 300W Motor Control Application Kit features Infineon’s OptiMOS™ technology, providing a simple to use Evaluation Board for testing and analyzing any brushless DC motor equipped with hall sensors. The components of the board include 6 pieces of OptiMOS™ (BSC016N06N3 G), an EiceDRIVER™ (6ED003L02-F2) and a Microcontroller (XC836). Together they enable brushless DC motors to run up to 300W without additional cooling. Key features and benefits n High efficiency MOSFETs and MCU n Easy plug and play software with Graphical User Interface for fast testing of the board n Suitable for any BLDC motors with hall sensors n Optimized thermal management n Voltage, current and speed control possible For further information please visit our website: Watch the Video!

3 Solution Matrix EiceDRIVER™ Compact (2EDL23N06) XMC 4000 EiceDRIVER™ Compact (2EDL05N06, 6EDL04N02PR, 6ED003L02-F2) XMC 1000 OptiMOS™ 20V-60V Small Signal (SOT-363, TSOP-6) Forklift Light Electric Vehicle Cordless Tools Showing only drives dedicated devices. For complete portfolio, please check our homepage OptiMOS™ 60V-150V Solution Matrix for Battery Powered Motor Drives Offering Industry’s Leading High Performance Products MOSFET Driver ICs Microcontroller Based on Industry Leading Technology, highest quality and manufacturing expertise Infineon provides a variety of innovative power semiconductors which enables designers to develop highly reliable and efficient solutions for all kinds of drive applications.

4 Forklift Solution Forklift Solution Highest Performance and Innovative Solutions Requirements such as highest current capability, optimized thermal performance and reliable operation in harsh environments are essential for all kinds of Forklift designs. Therefore, Infineon offers a broad range of products demonstrating lowest RDS(on) , highest current capability up to 300A and a wide selection of innovative package solutions. System Voltage Class Voltage Class D2 PAK D2 PAK 7pin TO-Leadless 24V 60V IPB029N06N3 G IPB010N06N IPT007N06N 36V 80V IPB025N08N3 G IPB019N08N3 G 48V 100V IPB027N10N3 G IPB025N10N3 G IPT020N10N3 72V/ 80V 150V IPB 072N15N3 G IPB065N15N3 G IPT059N15N3 Infineon’s OptiMOS™ for Forklift Applications Brushless DC Motor Driver Stage Sensor Sensor Sensor DC /DC Regulators Controller XMC-Microcontroller OptiMOS™ EiceDRIVER™

5 Forklift Solution Infineon’s EiceDRIVER™ for Forklift Applications Infineon’s ARM® Cortex™ based Microcontroller Family XMC4100 XMC4200 XMC4400 XMC4500 System Core ARM® Cortex™ M4 CPU Frequency 80MHz 80MHz 120MHz 120MHz Co-Processor Floating Point Unit Flash Size 128kB 256kB 512kB 1MB RAM Size 20kB 40kB 80kB 160kB Cache 4kB 4kB 4kB 4kB Timers POSIF 1x 1x 2x 2x CCU4 (4ch) 2x 2x 4x 4x CCU8 (4ch) 1x 1x 2x 2x High-resolution PWM (150ps) Channels 4x 4x 4x - Signal Processing ADC 12-bit 2x 2x 4x 4x Δ∑ Demodulator - - 4x 4x DAC 2x 2x 2x 2x Communication IEEE 15BB Ethernet MAC - - 1x 1x USB FS DEV FS DEV FS OTG FS OTG SDIO/SD/MMC - - -  Serial Channels (UART, SPI, I2 C, I2 S) 4x 4x 4x 4x External Memory I/F - - -  CAN 2x 2x 2x 3x Topology DSO-8 DSO-14 Halfbridge 2EDL05N06PF 2EDL23N06PJ

6 Cordless Tool Solution Cordless Tool Solution Highest Power Density and System Efficiency Depending on the topology, cordless tools require either space optimized designs for system miniaturization or cost optimized solutions to decrease total system costs. For both requirements Infineon offers the right products with low RDS(on) in compact packages such as SuperSO8 and products at an excellent price/performance ratio without sacrificing product performance and reliability. System Voltage Class Voltage Class TO-220 SuperSO8 CanPAK™ < 18V 30V BSC011N03LS BSB012N03LX3 G ≥ 18V - 24V 40V IPP015N04N G BSC010N04LS BSB014N04LX3 G 36V 60V IPP024N06N3 G BSC014N06NS BSB028N06NN3 G Infineon’s OptiMOS™ for Cordless Tools Brushless DC Motor Driver Stage Sensor Sensor Sensor Brushed DC Motor DC /DC Regulators Controller Driver Stage XMC-Microcontroller OptiMOS™ EiceDRIVER™ OptiMOS™ EiceDRIVER™

7 Cordless Tool Solution Infineon’s EiceDRIVER™ for Cordless Tools Infineon’s ARM® Cortex™ based Microcontroller Family Topology DSO-8 DSO-14 TSSOP-28 Halfbridge 2EDL05N06PF 2EDL05N06PJ 3-Phase (B6) 6EDL04N02PR 6ED003L06-F2 XMC1300 System Performance Core ARM® Cortex™ M0 CPU Frequency 32 MHz Co-Processor MATH Flash Size 8-200kB RAM Size 16kB POSIF 1x Timers CCU4 (4ch) 1x CCU8 (4ch) 1x Signal Processing ADC 12-bit 1x (2x S&H) Coparator 3x Communication Serial Channels (UART, SPI, I2 , I2 S) 2 Channel Application Specific LED Dimming & Color Control 

8 Light Electric Vehicle Solution Light Electric Vehicle Solution Performance Leadership and System Solution With a broad portfolio of Microcontrollers and power devices Infineon is able to meet a wide range of requirements for Light Electric Vehicles such as e-Scooters, Pedelecs or Microcars. Our products demonstrate outstanding reliability and quality as well as a very high current capability and excellent thermal performance. Infineon’s OptiMOS™ for Light Electric Vehicles Brushless DC Motor Driver Stage Sensor Sensor Sensor DC /DC Regulators Controller XMC-Microcontroller OptiMOS™ EiceDRIVER™ System Voltage Class Voltage Class D2 PAK D2 PAK 7pin TO-Leadless TO-220 24V 60V IPP032N06N3 G 75V IPB020NE7N3 IPP034NE7N3 36V 80V IPB025N08N3 G IPB019N08N3 G IPP037N08N3 48V 100V IPB027N10N3 G IPB025N10N3 G IPT020N10N3 IPP045N10N3 72V 150V IPB072N15N3 G IPB065N15N3 G IPT059N15N3

9 Light Electric Vehicle Solution Infineon’s EiceDRIVER™ for Light Electric Vehicles Infineon’s ARM® Cortex™ based Microcontroller Family XMC4100 XMC4200 XMC4400 XMC4500 System Core ARM® Cortex™ M4 CPU Frequency 80MHz 80MHz 120MHz 120MHz Co-Processor Floating Point Unit Flash Size 128kB 256kB 512kB 1MB RAM Size 20kB 40kB 80kB 160kB Cache 4kB 4kB 4kB 4kB Timers POSIF 1x 1x 2x 2x CCU4 (4ch) 2x 2x 4x 4x CCU8 (4ch) 1x 1x 2x 2x High-resolution PWM (150ps) Channels 4x 4x 4x - Signal Processing ADC 12-bit 2x 2x 4x 4x Δ∑ Demodulator - - 4x 4x DAC 2x 2x 2x 2x Communication IEEE 15BB Ethernet MAC - - 1x 1x USB FS DEV FS DEV FS OTG FS OTG SDIO/SD/MMC - - -  Serial Channels (UART, SPI, I2 C, I2 S) 4x 4x 4x 6x External Memory I/F - - -  CAN 2x 2x 2x 3x Application Specific Touch Control / LED Display Matrix     Topology DSO-8 DSO-14 TSSOP-28 Halfbridge 2EDL05N06PF 2EDL05N06PJ 3-Phase (B6) 6EDL04N02PR 6ED003L06-F2

10 MOSFETs Always a Step Ahead with Infineon Leverage your Performance Features „„ High current capability „„ Lowest RDS(on) „„ Easy-to-design products „„ Outstanding product quality Benefits „„ Enables optimized thermal management „„ Enables system cost reduction & system miniaturization „„ Extending battery lifetime „„ Reliable operation in harsh environments Within the motor control market segment low voltage applications include the sub segment battery powered applications. These are high current applications such as Forklift, e-Scooter, Pedelecs or Cordless Power Tools with a wide range of system power from 1W to 50kW. These applications require: „„ extension of battery lifetime and range „„ reliable operation in harsh environments „„ system miniaturization and cost reduction „„ optimized thermal management Infineon offers a comprehensive motor control and drives solution portfolio containing leading edge technologies in low voltage Power MOSFETs, Driver ICs, position sensors (hall and angle sensors) and the newest ARM® Cortex™-M4 based MCU. These products enable efficient, robust and cost- effective designs for all types of motors. OptiMOS™ – the right switch for each battery powered drive application 12 24 36 48 72 80 100 150 300 250 200 150 120 100 75/80 60 40 30 25 0 HOTTER System Voltage [V] MOSFETVoltage[V]

11 Soloreiust cone pratende TO-Leadless A Package Optimized for High Current Applications Infineon’s new TO-Leadless package is especially designed for high current applications such as Forklift, Light Electric Vehicles, e-fuse, PoL (Point of Load) and Telecom where highest efficiency and reliability are required. 300A continuous current can now be handled using just one single part. Furthermore, compared to D2 PAK 7pin, this significantly smaller package with 60% size reduction offers a very compact design and a substantial reduction of 30% in the footprint. Key features and benefits n Industry’s lowest RDS(on) , reduced footprint and space – Enables highest efficiency and system cost reduction n Highest current capability up to 300A – Requires less cooling n Reduced package parasitics – Enables improved EMI-performance – Lower package losses For further information please visit our Website: Watch the Video!

12 MOSFETs Power MOSFETs OptiMOS™ 20V-300V The Right MOSFET for Each System Highest efficiency with SuperSO8 Moving from TO-220 to SuperSO8 reduces space consumption drastically and offers lower parasitic, highest efficiency and lo- west design effort due to reduced spikes. D²PAK optimized for high power applications A change from TO-220 to D2 PAK 7pin gives several advantages and offers an ideal combination of industry’s lowest RDS(on) and high current capability. Furthermore, it comes with very low package parasitics and enables highest system reliability due to no hot spot. TO-Leadless – industry’s highest current capability TO-Leadless is a package optimized for high current applications with a current capability of 300A. It enables compact de- signs due to reduced footprint and height compact designs. Infineon provides a comprehensive portfolio of low voltage MOSFETs supporting all requirements for Battery Powered Applications. The Power MOSFET family - OptiMOS™ 20V up to 300V is consistently setting the benchmark in key specifications for drives system designs, including leading on-state resistance or highest current capability which lead to reduced power losses and improved system reliability. Infineon’s OptiMOS™ is available in innovative packages which are either optimized for space saving such as CanPAK™ or SuperSO8 or optimized for high current such as TO-Leadless. Benefits of Infineon components Reliable and robust products for highest system durability and reliability „„ Lowest RDS(on) 0.7mΩ in TOLL and highest current 300A capability for highest system efficiency „„ Small form factors for compact design e.g. SuperS08 30mm², TOLL 115mm² leading to reduction of overall system size and cost „„ Evaluation boards for fast prototyping and testing and in-depth system support enable reduction of development time and cost 25 50 100 150 200 250 300 350 2.5 2.0 1.5 1.0 0.5 0 S308 CanPAK™ S/M SuperSO8 TO-Leadless TO-220D2 PAK 7pin D2 PAK COOLER SMALLER HOTTER LARGER DPAK Package Area [mm²] ThermalResistance[K/W]

13 MOSFETs Small Signal The Perfect Fit for your Battery Powered Application Voltage SOT-223 TSOP6 SOT-89 SC-59 SOT-23 SOT-323 SOT-363 P-ChannelMOSFETs -250 BSP317P 4Ω, -0.43A, LL BSP92P BSS192P BSR92P 12Ω, -0.26A, LL 12Ω, -0.19A, LL 11Ω, -0.14A, LL -100 BSP321P 900mΩ, -0.98A, NL BSP322P 800mΩ, -1.0A, LL BSP316P BSR316P 1.8Ω, -0.68A, LL 1.8Ω, -0.36A, LL -60 BSP612P 1) 120mΩ, 3A, LL BSP613P BSS83P 130mΩ, 2.9A, NL 2Ω, -0.33A, LL BSP170P BSS84P BSS84PW 300mΩ, -1.9A, NL 8Ω, -0.17A, LL 8Ω, -0.15, LL BSP171P 300mΩ, -1.9A, LL BSP315P BSR315P 800mΩ, -1.17A, LL 800mΩ, -0.62A, LL -30 BSL303SPE1) BSR303PE3) ~30mΩ, ~-6.6A, LL ~30mΩ, ~-3.3A, LL BSL305SPE1) BSR305PE3) ~50mΩ, ~-5.3A, LL ~50mΩ, ~-2.7A, LL BSL307SP BSS308PE 43mΩ, -5.5A, LL 80mΩ, -2.1A, LL, ESD BSL308PE BSS314PE 80mΩ, -2.1A, LL, dual, ESD 140mΩ, -1.5A, LL, ESD BSL314PE BSS315P BSD314SPE 140mΩ, -1.5A, LL, ESD, dual 150mΩ, -1.5A, LL 140mΩ, -1.5A, LL, ESD BSS356PWE2) BSD356PE2) ~560mΩ, ~0.73A, LL ~560mΩ, ~0.73A, LL -20 BSL207SP BSS209PW BSV236SP 41mΩ, -6A, SLL 550mΩ, -0.58A, SLL 175mΩ, -1.5A, SLL BSL211SP BSS223PW BSD223P 67mΩ, -4.7A, SLL 1.2Ω, -0.39A, SLL 1.2Ω, -0.39A, SLL, dual BSS215P 150mΩ, -1.5A, SLL Complementary -20/20 BSL215C BSD235C N: 140mΩ, 1.5A, SLL P: 150mΩ, -1.5A, SLL N: 350mΩ, 0.95A, SLL P: 1.2Ω, -0.53A, SLL -30/30 BSL316C N: 160mΩ, 1.4A, LL P: 150mΩ, -1.5A, LL BSL308C BSD356C2) N: 57mΩ, A, LL P: 80mΩ, A, LL, N: 350mΩ, 0.95A, LL P: ~560mΩ, ~0.73A, LL N-ChannelMOSFETs 20 BSL802SN BSR802N 22mΩ, 7.5A, ULL 23mΩ, 3.7A, ULL BSL202SN BSR202N BSS806NE 22mΩ, 7.5A, SLL 21mΩ, 3.8A, SLL 57mΩ, 2.3A, ULL, ESD BSL806N BSS806N BSD816SN 57mΩ, 2.3A, ULL, dual 57mΩ, 2.3A, ULL 160mΩ, 1.4A, ULL BSL205N BSS205N BSD214SN 50mΩ, 2.5A, SLL, dual 50mΩ, 2.5A, SLL 140mΩ, 1.5A, SLL BSL207N BSS816NW BSD840N 70mΩ, 2.1A, SLL, dual 160mΩ, 1.4A, ULL 400mΩ, 0.88A, ULL, dual BSL214N BSS214N BSS214NW BSD235N 140mΩ, 1.5A, SLL, dual 140mΩ, 1.5A, SLL 140mΩ, 1.5A, SLL 350mΩ, 0.95A, SLL, dual 30 BSL302SN BSR302N BSS306N 25mΩ, 7.1A, LL 23mΩ, 3.7A, LL 57mΩ, 2.3A, LL BSL306N BSS316N BSD316SN 57mΩ, 2.3A, LL, dual 160mΩ, 1.4A, LL 160mΩ, 1.4A, LL 55 BSS670S2L 650mΩ, 0.54A, LL 60 BSP318S BSL606SN BSS606N BSR606N BSS138N BSS138W 90mΩ, 2.6A, LL 60mΩ, 4.5A, LL 60mΩ, 3.2A, LL 60mΩ, 2.3A, LL 3.5Ω, 0.23A, LL 3.5Ω, 0.28A, LL BSP320S BSS7728N 120mΩ, 2.9A, NL 5Ω, 0.2A, LL BSP295 SN7002N SN7002W 300mΩ, 1.8A, LL 5Ω, 0.2A, LL 5Ω, 0.23A, LL 2N7002 2N7002DW 3Ω, 0.3A, LL 3Ω, 0.3A, LL, dual BSS159N 8Ω, 0.13A, depl. 75 BSP716N BSL716SN1) 160mΩ, 2.3A, LL 150mΩ, 2.5A, LL 100 BSP373N BSL373SN1) BSS169 240mΩ, 1.8A, NL 230mΩ, 2.0A, NL 12Ω, 0.09A, depl. BSP372N BSL372SN1) BSS119N 230mΩ, 1.8A, LL 220mΩ, 2.0A, LL 6Ω, 0.19A, LL VGS(th) 1.8V to 2.3V BSP296N BSL296SN1) 600mΩ, 1.2A, LL 460mΩ, 1.4A, LL BSS123N 6Ω, 0.19A, LL VGS(th) 0.8V to 1.8V 200 BSP297 1.8Ω, 0.66A, LL BSP149 3.5Ω,0.14 A, depl. 240 BSP88 BSS87 BSS131 6Ω, 0.35A, 2.8V rated 6Ω, 0.26A, LL 14Ω, 0.1A, LL BSP89 6Ω, 0.35A, LL BSP129 6Ω, 0.05A, depl. 250 BSS139 30Ω, 0.03A, depl. 400 BSP298 3Ω, 0.5A, NL BSP324 25Ω, 0.17A, LL 500 BSP299 4Ω, 0.4A, NL 600 BSP125 BSS225 BSS127 45Ω, 0.12A, LL 45Ω, 0.09A, LL 500Ω, 0.023A, LL BSP135 BSS126 60Ω, 0.02A, depl. 700Ω, 0.007A, depl. 800 BSP300 20Ω, 0.19A, NL 1) Coming Q2 2014 2) Coming Q3 2014 3) Coming Q4 2014

14 Driver ICs EiceDRIVER™ Compact 600V Half Bridge Driver ICs for Battery Powered Applications Features „„ High creepage distance in DSO-14 „„ Integrated low-ohmic bootstrap diode „„ Specific undervoltage lockout levels for MOSFET „„ Rail-to-rail output Applications „„ Fans, Pumps „„ Forklift and Low Speed Cars „„ e-Scooter, e-Bikes Developers of battery powered applications continuously strive for higher efficiency of applications and smaller form factors. One area of interest is, that the switching behavior and power losses of new Power MOSFETs can be optimized by dedicated driver ICs. Infineon’s new 2EDL EiceDRIVER™ Compact is a 600V half bridge gate driver IC family. Its level-shift SOI (Silicon-On-Insulator) technology supports both design goals. With the monolithic integrated low-ohmic and ultrafast bootstrap diode this new generation 2EDL is a benchmark for driver ICs in the market with more than 2A output current. 2EDL05N06PF (DSO-8) and 2EDL05N06PJ (DSO-14) are driver ICs with the same features, but with undervoltage-logout for MOSFETs. These two parts are recommended for low voltage drives such as e-Bikes. 2EDL23N06PJ (DSO-14) is a 2.3A half bridge driver ICs for MOSFETs. It provides interlock, deadtime and in addition enable, fault and overcurrent protection. It is well performed for e-Scooter and Forklift. Sales Code and Package (150mil) 2EDL05N06PF (DSO-8) 2EDL05N06PJ (DSO-14) 2EDL23N06PJ (DSO-14) Applications LV-Drives, e-Bike, Battery, Forklift, Power Tools (Cordless) Battery, e-Scooter, Forklift, Power Tools (Cordless) Blocking Voltage 600V 600V Output Current 0.25A /-0.5A 1.8A / -2.3A Integrated Bootsrap Function Ultrafast BS diode and BS resistor Ultrafast BS diode and BS resistor UVLO (latest turn-off) MOSFET (7.5V) MOSFET (7.5V) Features Deadtime, interlock Deadtime, interlock enable, fault, OCP RLIM DBSVDD GND VB CBS VBUS HO VS LO 2EDL-family

15 Microcontroller XMC – 32-bit Industrial Microcontroller Over 100 Devices Arranged in a Portfolio Optimized for Industrial Applications XMC 32-bit MCU portfolio offers a wide and scalable set of products delivering outstanding real-time performance, powerful features and high integration, high quality standards and long-term product availability as well as high oper- ating temperature. XMC1000 Family „„ Up to 32MHz ARM® Cortex™-M0 „„ 64MHz Math Co-Processor (CORDIC) „„ 8kB to 200kB Flash „„ 16kB SRAM „„ Up to 32 general purpose IOs (GPIOs) „„ Rich analog-mixed signal (ADC, CMP) „„ Precision Timing/PWM (up to 64MHz) „„ Configurable communication interfaces „„ Application specific peripherals „„ Brightness Color Control Unit (BCCU) „„ LED Matrix and Touch (LEDTS) „„ Position Interface (POSIF) Operating Conditions „„ Temperature: -40°C to 105°C TAMBIENT „„ Voltage: 1.8V to 5.5V XMC4000 Family „„ Up to 120MHz ARM® Cortex™-M4 „„ DSP, FPU, DMA and MPU „„ 64kB to 1MB Flash with ECC „„ 20 to 160kB SRAM with up to 4kB Cache „„ Up to 91 general purpose IOs (GPIOs) „„ Rich analog-mixed signal (ADC, DAC) „„ Precision Timing/PWM (up to 120MHz) „„ Configurable communication interfaces „„ Application specific peripherals „„ Delta-Sigma-(Δ∑)-Demodulator „„ High Resolution PMW (150ps, HRPWM) „„ POSIF, EBU, USB, SD/MMC, Ethernet Operating Conditions „„ Temperature: -40°C to 125°C TAMBIENT „„ Voltage: 3.13V to 3.63V XMC1100 Basic Series XMC1200 + BCCU +LEDTS XMC1300 + CORDIC + ERU XMC4100 Basic Series XMC4200 + MEMORY +GPIOs XMC4400 + MEMORY + ETHERNET XMC4500 +SD Card + EBU Feature Integration Performance ARM® Cortex™-M4 with DSP, FPU, MPU, DMA M ore than 100 devices New ARM® Cortex™ based Microcontroller Family XMC MCUs are architectured for embedded industrial applications and characterize by „„ Application specific feature – Delta-Sigma-(Δ∑)-Demodulator (DSD), High Resolution PWM, Brightness Color Control Unit „„ Precision and Control – Timer/PWM (CCU) can run up to 120MHz, up to 64-bit width offering fault inputs and binary / floating clock prescaler „„ Real-Time and Process Parallelization – Module Interconnect Matrix, interaction between peripherals to offload CPU „„ Quality and Robustness – Error Code Correction (ECC), Margin Check, Oper- ating Temperature up to 125°C TAMBIENT , >=20 years Data, Retention, Built-in Safety Feature (Window Watchdog, Broken Wire Detection) and free IEC60730 Class B library Ecosystem „„ The wide ARM® Ecosystem (Atollic, IAR, Keil MDK, Rowley, TASKING and others) „„ Free Infineon DAVE™ „„ Eclipse CDT based IDE „„ ARM® GNU compiler „„ Free debugger and Flash loader „„ Data visualization tool called xSPY „„ Providing a resource solver „„ DAVE™ Apps – a tailored and object-oriented software library of 170 Apps to efficiently use the innovative set of peripherals of the XMC MCUs

Published by Infineon Technologies Austria AG 9500 Villach, Austria © 2014 Infineon Technologies AG. All Rights Reserved. Visit us: Order Number: B152-H9712-G1-X-7600-DB2014-0004 Date: 02 / 2014 Attention please! The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/ or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warran- ties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technolo- gies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reason- able to assume that the health of the user or other persons may be endangered. Ask Infineon. Get connected with the answers. Infineon offers its toll-free 0800/4001 service hotline as one central number, available 24/7 in English, Mandarin and German. Our global connection service goes way beyond standard switchboard services by offering qualified support on the phone. Call us! „„ Germany ................. 0800 951 951 951 (German/English) „„ China, mainland ..... 4001 200 951 (Mandarin/English) „„ India ...................... 000 800 4402 951 (English) „„ USA ........................ 1-866 951 9519 (English/German) „„ Other countries ....... 00* 800 951 951 951 (English/German) „„ Direct access .......... +49 89 234-0 (interconnection fee, German/English) * Please note: Some countries may require you to dial a code other than “00” to access this international number, please visit for your country! Infineon Technologies – innovative semiconductor solutions for energy efficiency, mobility and security. Where to Buy Infineon Distribution Partners and Sales Offices: Stay connected Mobile Product Catalog

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