Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 3

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Published on March 5, 2014

Author: Manuscriptedit_doc

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Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd)

Referneces :-
* Aqueous electrophoretic deposition (epd) Part - 1 : http://goo.gl/aH06fC

* Aqueous electrophoretic deposition (epd) Part - 2 : http://goo.gl/tu9F4Y

Part - 3 APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) www.manuscriptedit.com

Constant current Continuous DC EPD

Constant current Continuous DC EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Constant current Pulsed EPD

Mechanism 1.How the particles maintain electrophoretic mobility during pulse OFF time. 2.Why the bubble incorporation decreases at lower pulse widths. ?? Contd….PART - 4

APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 4 (Coming Soon) THANK YOU VISIT www.manuscriptedit.com

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