Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2

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Information about Application of pulsed dc to suppress bubble incorporation & control...

Published on March 1, 2014

Author: Manuscriptedit_doc

Source: slideshare.net

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Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd)

Part - 2 APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) www.manuscriptedit.com

Objectives  Develop a generic aqueous EPD process applicable to all types of suspension and substrates by use of pulsed DC.  Control the extent of gas bubble incorporation and the morphology of the deposit.  Study and optimize the process parameters to obtain smooth, homogeneous and bubble-free deposits.  Develop understanding on the involved mechanism.

Experimental

Zeta potential

Constant voltage Continuous DC EPD

Constant voltage Pulsed DC EPD

Conventional EPD process

Constant voltage Pulsed DC EPD

Constant voltage Pulsed DC EPD

APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 3 (Coming Soon) THANK YOU VISIT www.manuscriptedit.com

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