Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous Electrophoretic deposition (epd) : part - 1

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Published on February 22, 2014

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APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)

Part - I APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) www.manuscriptedit.com

Application of EPD Process

Advantage of EPD Process

Challenges

Choice of solvent & applied current

Conventional EPD process

Aqueous EPD process

How to control water electrolysis and bubble incorporation in the deposit ?

Previous attempts to develop Aqueous EPD

APPLICATION OF PULSED DC TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 2 (Coming Soon) THANK YOU VISIT www.manuscriptedit.com

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