Advanced Packaging Technologies Intro

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Information about Advanced Packaging Technologies Intro

Published on July 2, 2009

Author: ryansmta


Workshop Preview : Workshop Preview Advanced Packaging Technologies and Future Interconnection Trends Instructor Joseph Fjelstad Verdant Electronics October 4 - 8, 2009  The Town and Country Resort and Convention Center  San Diego, CA Advanced Packaging… Who Cares? : Advanced Packaging… Who Cares? Everyone in the global electronic industry is significantly impacted by decisions routinely made by the electronic packaging community. Nowhere is that impact more deeply felt than in the realm of surface mount technology The simple truth is that IC packaging has long lead the march of interconnection technology and it will likely continue to do so in the foreseeable future We are now in the midst of significant change, where once bright lines between the different levels of the electronic interconnection hierarchy are blurring. With that change comes both challenge and opportunity Some time based perspective helps to appreciate this change and perhaps help us chart a successful course The Evolution of Electronic Assembly : The Evolution of Electronic Assembly ~1940 2009 ? Workshop Topics : Workshop Topics Role of IC packaging technologies in electronics assembly Construction & manufacturing processes for common IC packages Impact of IC package design on the assembly processes Chip scale and Wafer Level packaging types Reliability testing & electrical performance of CSPs The continuing impact of lead-free & alternative approaches Interconnection substrate challenges and solutions IC testing structures and strategies New and evolving 3-D packaging concepts (JISSO) What’s new, & where IC packaging technology is headed Trends in the integration of the IC, the package & PCB substrate The future of IC packaging and interconnections Where and When? : Where and When? The Town and Country Resort and Convention Center San Diego, CA  Sunday, October 4, 20091:30pm – 5:00pm

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