A3 2 Cihangir

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Information about A3 2 Cihangir

Published on February 7, 2008

Author: Monica

Source: authorstream.com

Study of Bump-Bond Technology:  Study of Bump-Bond Technology Selcuk Cihangir Fermilab BTeV Pixel Group 9th Workshop on Electronics for LHC Experiments, Sept.29-Oct.3, 2003 Outline:  Outline Thermo Cycling Glass-Si Modules Thermo Cycling Single-Chip Modules Cryo Test of Bumps and Wire Bonds Results Conclusions Concern: Yield, reliability, effects due to thermo cycling, CTE mismatch to substrate, radiation effects…. Previous Work: Fermilab-Conf-00-168-E, Sep. 2000 / NIM A476 (2002) 670-675. Fermilab-Conf-01-251-E, Sep. 2001, Presented at LECC2001, Stockholm, Sweden. Fermilab-Conf-01-377-E, Dec. 2001 Slide4:  Pixel Detector Pixel Sensor bump-bonded to Readout chip Two possible technologies: Indium and Pb/Sn solder bumps Fine segmentation Large number of channels Electronics in the active tracking volume High power density Large amount of data Large number of HDI and cables 1x8 Glass-Si Modules ATLAS Tile Sensors:  1x8 Glass-Si Modules ATLAS Tile Sensors 2 Modules: AIT_1 & 2 Indium Bumps by AIT 163x18 bumps/chip 4 Modules: MCNC_1,2,3 & 4 Solder (Eutectic 37% Pb-63% Sn Bumps by MCNC 170x18 bumps/chip Advantage: Visual sight of what is going on Issues: CTE mismatch between Si and Glass, stress worse than real case (Si-Si) Adhesion of bumps to glass could also be difficult. Thermo Cycling Process:  Thermo Cycling Process MCNC Modules (Solder Bumps): All: 6 cycles of 16 hours at –25Co and 4 hours at room temp. 1 & 2: Irradiated to 13 MRad 3 & 4: 20 cycles of 10 hours at –25Co and 2 hours at room temp. All: 30 cycles of 6 hours at –25Co and 1 hour at room temp. 1 & 3 glued on TPG (Thermal Pyrolytic Graphite) All: 105 cycles of 1 hour at –10Co and 1 minute at room temp. (Rapid Thermo Cycling) AIT Modules (Indium Bumps): Both: 5 cycles of 10 hours at –10Co and 4 hours at room temp. AIT_2 glued on TPG Both: 105 cycles of 1 hour at –10Co and 1 minute at room temp. (Rapid Thermo Cycling) Slide7:  Typical Thermo Cycle A commercial freezer converted into controlled temperature volume via LabView. Video Acquisition Setup:  Video Acquisition Setup 8 mm Tape Recorder DVD+WR PC/Motion Control Mixer Monitor Motion Table Camera Module Video Analysis Setup:  Video Analysis Setup DVD Player DVD-WR Indium Bumps:  Indium Bumps Indium bump UBM Passivation Al pad “Damaged” Indium Bumps:  “Damaged” Indium Bumps Before Thermo Cycling After 1st Thermo Cycling After Rapid Thermo Cycling More Damaged Indium Bumps:  More Damaged Indium Bumps Before Thermo Cycling After 1st Thermo Cycling After Rapid Thermo Cycling Count of “Damaged” Indium Bumps (Messy/Bad Regions are not counted):  Count of “Damaged” Indium Bumps (Messy/Bad Regions are not counted) 163x18 = 2934 bumps/chip, 8 chips/module Other Problems:  Other Problems Different Size Bumps Messy Bumps Something Develops at the Base Different Looks at Center of Bumps (UBM) …And, Chips Shift:  …And, Chips Shift Chip No: 1 Correct Position (compared with the other chips) Position Before Thermo Cycling Position After 1st Thermo Cycling Position After Rapid Thermo Cycling Chip No: 3 shifts down after the 1st Thermo Cycling and shifts left and rotates clockwise after the Rapid Thermo Cycling NO shift due to TPG detected Solder Bumps:  Solder Bumps Via- this center bright area is the via (red area in red oval) BCB-this first dark ring is the sidewall of the via, sloping upwards to the top surface of the BCB (blue area in blue oval) Bump – the outer dark ring is the solder bump. The bump is super-hemispherical, so the bump diameter > bump base diameter (orange oval area) BCB leveling off - this outer bright ring is the flat area of the bump on top of the BCB (green area in green oval) BCB-Benzocyclebutane, an organic compound used to define plating (where to put the UBM and the solder bump) Color Change on Second Ring:  Color Change on Second Ring ~2% (mostly on the edge) of bumps look this way. Starting with 2nd Thermo Cycling and Radiation, the inner dark ring blends into light ring. Occurs mostly on the edge bumps. One such change reverses itself at the next thermal cycling: BCB is shrinking to lift up reflecting the light partially. At one bump the BCB shrinks back down. Color Change Count-New Occurrences (Excluding MCNC_1) Development of “Extrusions” & Thickening of Outer Ring:  Development of “Extrusions” & Thickening of Outer Ring Before After Before After Extrusion starts developing at the 2nd Thermo Cycling and Radiation (~ 50 per module). They seem to be on the surface (glass side) and mostly on the edge bumps. Might be due ionic contamination (BCB originated), not completely removed during final cleaning. Other Problems:  Other Problems Not cleaned well, 2 chips on MCNC_4 Chip-8 at MCNC_4 Different Size Bumps 1- 2 % on all modules Very few, on all modules And, Chips do NOT shift!:  And, Chips do NOT shift! Neither heat nor cold, nor being glued to TPG caused any detectable shift on the four MCNC solder bump 8-chip modules. No effect of Radiation either. Chip Assemblies:  Chip Assemblies M. Turqueti et. al. IEEE Nuclear Science Symposium, Portland, Oregon, USA,Oct.20-24, 2003 Schematic Look:  Schematic Look FLEX CIRCUIT HEAT SINK HEAT PUMP (peltier device) BUMP BONDS WIRE BOND PIXEL CHIP PIXEL SENSOR FLEX CIRCUIT DECOUPLING CAPACITOR PCB FPIX1 Hit Map (Sr90):  Hit Map (Sr90) Pspray/Indium Bump 1st Cycle After Thermo Cycle Pspray/Solder Bump 1st Cycle After Thermo Cycle Very little effect…. Cryo Test:  Cryo Test Cryo Assembly PCB with a Dummy Hybrid glued on TPG First assembly with 15 channels at LN2 temperatures survived two cycles with no damage to solder bumps or the wire bonds. Second assembly with 40 channels will be tested soon. More assemblies will be built. Precaution Test since we use LN2 in vacuum and cooling systems. Conclusions:  Conclusions Damage seen on Indium bumps, though not significant in numbers, might explain the increase in noise (due possible capacitance change) on readout electronics (~1-2% level). No effect of TPG CTE mismatch observed on either Indium or Solder Bumps. Solder bumps are not affected by LN2 temperatures (low statistics). Cleanliness, uniformity (pressing, alignment, etc.) during bump bonding process are the issues. Overall, Solder Bumps look more robust than Indium Bumps. Hit Map (Sr90):  Hit Map (Sr90) 1st Cycle After thermo cycle 1st Cycle After thermo cycle Pspray/Solder Bump Pspray/Indium Bump

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